📅 July 20–23, 2026 · Busan, Korea
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The 3rd International Conference on Heterostructured Materials
July 20–23, 2026 | Hanhwa Resort Haeundae, BUSAN, Korea
Abstract Submission : Mar. 1 – June 5, 2026 / Early-Bird Registration : Apr. 1 – June 30, 2026

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CONFERENCE HIGHLIGHTS

Explore the rapidly emerging field of heterostructured materials (HSM), where strong property gradients and synergistic interactions open pathways to unprecedented mechanical and physical performance.

This conference brings together leading experts to discuss fundamental mechanisms, scalable processing routes, and future directions that will shape the next frontier of HSM research.

Conference Notices

Early Bird Registration Closes on June 30 ▸
Jun 29, 2026 15:58
We would like to remind all participants that the Early Bird Registration deadline is June 30.
Be sure to complete your registration by the deadline to receive the discounted registration fee.

Register Here
Notice on Poster Presentation Schedule & Codes ▸
Jun 29, 2026 12:49
We are pleased to announce that the poster presentation schedule and presentation codes for iHSM III are now available.
Please kindly review the attached PDF documents to confirm your individual code and schedule.

The poster session will proceed as follows:
Set-up: 16:00–17:00, July 21 (Tue), 2026
Presentation: 17:30–19:00, July 21 (Tue), 2026
Tear-down: 19:00–20:00, July 21 (Tue), 2026
Venue: Monterosso Hall, B1 Floor
📥 iHSM3_Poster-Presentation-Schedule_Announcement_2-1.pdf
Notice on Abstract Review Results ▸
Jun 23, 2026 10:07
We are pleased to announce that the abstract review process for iHSM3 has been completed.
You can view your review result by logging into your account via the link below:
▶ Check Results: https://www.ihsm3.org/submission/
Thank you for your contribution to iHSM3.
Plenary Speakers

Irene J. Beyerlein

UC Santa Barbara (UCSB), USA

Jae-il Jang

Hanyang University, South Korea

Suveen Mathaudhu

Colorado School of Mines, USA

Dmytro Orlov

Lund University, Sweden

Matteo Seita

University of Cambridge, UK

Nobuhiro Tsuji

Kyoto University, Japan

Jian-Zhong Jiang

Fuyao University of Science and Technology, China

David Srolovitz

The University of Hong Kong, Hong Kong

IMPORTANT DATES
First Announcement & Website Launch
November 20, 2025
Second Announcement
January 10, 2026
Abstract Submission PeriodExtended
March 1 – May 20June 5, 2026
Notification of AcceptanceUpdated
June 5June 20, 2026
Early-bird Registration
April 1 – June 30, 2026
Standard Registration
July 1 – July 15, 2026
Conference Dates
July 20 – July 23, 2026
SPONSORS & PARTNERS
We gratefully acknowledge the generous support of our sponsors and partners who make iHSM3 possible. Their commitment enables use to bring together the global heterostructured materials community.
Ready to Join iHSM3?
Don’t miss this opportunity to connect with the global materials modeling community.
Submit Your Abstract
View Registration Fees
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